Axis 670 Manual de Instruções descarregar pdf (Página 6)

3.0. Description of Operation

3.1.

Overview

The 670 system's servo electronics are contained on a compact 2.5" x 4.0" multi-layer printed

circuit board. Each servo board has been tuned to the customer's particular mirror inertia so that

no adjustments are necessary unless the mirror inertia is changed. For those experienced in

servo electronics, there is a tuning section included in section 6.0. Also included is a complete

set of schematic and assembly drawings.

**Waming! Do not attempt to retune the servo until section 6.0. is fully understood. Damage

to the scanner could result.

**Note: If

cmtomer request the system was sent untuned, the user will have to follow the

tuning procedures in section 6.0 before the system will be ready for use. Also, if the system was

shipped without a nurror or other customer load, the system will always be shipped untuned.

The basic operation ofthe servo is: Accept a conmiand input voltage signal and tum it into a

stable, repeatable, angular position of the scaimer's output shaft. The amplifier does this by

combining the input information with the feedback information from the scanner to form an

error signal. The servo then strives to force this error signal to zero by rotating the scanner's

shaft. It is this "following" of the input signal that allows it to contiol the scanner's angular

position.

The rest ofthe electionics on the card is used to provide DC power and to monitor various error

conditions to ensure proper operation ofthe system.

3.2. Mechanical Layout

Refer

the 670 Outline Drawing located in section 6.0. for details ofthe mechanical layout.

The 670 servo board has four clearance holes for #4 screws located at the four comers of the

board. It is recommended to use all four mounting holesTFor best noise rejection, always ground

one ofthe screw holes on the scanner cormector (J2) side ofthe board to the chassis ground of

the instrument For maximum support and heatsinking, there are two #6 holes at the left and

right extremes of

the

black heat-sink bracket, and two #4 holes near the middle of

the

bracket.

BoMt^ this side ofthe bracket to a large

plate,

heat sink extrusion, or machine chassis and

using thermal joint compound will greatly increase the maximum power dissipation ofthe 670

board. If

this

is not done, expect no more than minimal output power capability and marginal

performance imder moderate loads. It is reconmiended that all four of the heat sink bracket

fasteners be ofthe "socket head" type.

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