
ADT Model 7100 Semi-Automatic Dicing System Operations Manual
Table of Contents
Advanced Dicing Technologies Ltd.
xvi
6.5.4 Chopping ______________________________________________________6.5-4
6.5.5 Multi-Panel Alignment _____________________________________________6.5-4
6.5.6 Cut Depth Compensation _________________________________________6.5-11
6.5.7 Negative Index _________________________________________________6.5-11
7 SAW PROCEDURES _________________________________ 7-1
7.1 Z-Axis Safety _______________________________________ 7.1-1
7.1.1 Z-Axis Safety Position ____________________________________________7.1-1
7.1.2 Z-Axis Return Height _____________________________________________7.1-1
7.1.3 Calibration Start Position __________________________________________7.1-1
7.1.4 Pre Non Contact Height ___________________________________________7.1-2
7.2 Blade Expansion ____________________________________ 7.2-1
7.3 Height Procedures ___________________________________ 7.3-1
7.3.1 Height Reference Device __________________________________________7.3-3
7.3.2 Chuck Height ___________________________________________________7.3-5
7.3.3 Chuck to Height Device Delta Measurement ___________________________7.3-5
7.3.4 Sample Blade Calibration __________________________________________7.3-6
7.3.5 Auto Height Compensation _________________________________________7.3-7
7.4 Blade Handling _____________________________________ 7.4-1
7.4.1 Blade Information ________________________________________________7.4-1
7.4.2 Blade Replacement (Change) ______________________________________7.4-7
7.4.3 Blade Dressing _________________________________________________7.4-15
7.5 Chuck Change ______________________________________ 7.5-1
7.5.1 Replacing the Chuck _____________________________________________7.5-1
7.5.2 Reteaching the Focus on the Chuck _________________________________7.5-3
8 SPECIAL FEATURES ________________________________ 8-1
8.1 Load Monitoring ____________________________________ 8.1-1
8.1.1 Load Monitoring with DC or AC Spindle _______________________________8.1-1
8.1.2 Online Monitoring ________________________________________________8.1-1
8.2 Language Selection __________________________________ 8.2-1
8.3 Wafer Vacuum Check ________________________________ 8.3-1
8.4 Open Loop Theta Accuracy Procedures _________________ 8.4-1
8.4.1 Stress Release __________________________________________________8.4-1
8.4.2 Theta Motion Replay _____________________________________________8.4-2
8.5 Spindle Velocity _____________________________________ 8.5-1
8.5.1 Reduced Height Velocity __________________________________________8.5-1
8.5.2 Reduced Vision Spindle Velocity ____________________________________8.5-2
8.6 Focus Change (Initial Focus Position) __________________ 8.6-1
8.7 Manual Inspection Illumination ________________________ 8.7-1
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